- Thermal mass differential pressure principle
- Turndown ratio 100:1 with high sensitivity design
- On-site K-factor correction
- Real-time display & system integration
- Versatile outputs
- Easy installation
- High compatibility
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Features -
Features- Silicon chips on differential pressure module of MEMS integration technology
- Offset function / UI software
- Low-pressure monitoring, high pressure resistance
- RS-485 communication interface(Optional), Modbus RTU protocol
- Physical unit switch(User Interface)：mbar / Pa / hPa / kPa / mmH2O / mmWS / inH2O / mmHg
- Square root function
-
Features- Silicon chips on differential pressure module of MEMS integration technology
- Offset function / UI software
- Low-pressure monitoring, high pressure resistance
- RS-485 communication interface (Optional), Modbus RTU protocol
- Physical unit switch (User Interface)：mbar / Pa / hPa / kPa / mmH2O / mmWS / inH2O / mmHg
- Square root function